Ningbo Shangjin Automation Technology Co., Ltd. (hereinafter referred to as "Shangjin Automation") was established in 2015 and is a National High-Tech Enterprise dedicated to the R&D and manufacturing of semiconductor packaging equipment, process technologies, and precision automation solutions.

Shangjin Automation is committed to becoming a leader in semiconductor packaging equipment and process technologies. With the company's business development and expansion, it hopes to manage the company's product design, manufacturing processes, project management, workflows, and collaboration through PLM. In the competitive process with internationally renowned PLM brands, SIPM impressed Shangjin Automation with its mature implementation philosophy for building technology R&D management platforms, rich application cases, globally leading MDA technology, and high cost-performance ratio. Ultimately, Shangjin Automation selected SIPM as its preferred choice to help build the PLM R&D management platform.

After introducing SIPM PLM, Shangjin Automation will be able to use an advanced R&D management platform for technology management, enhance innovation capabilities, and also flexibly respond to differentiated customer needs, quickly providing customers with high-quality products and services.

【Company Background】

Ningbo Shangjin Automation Technology Co., Ltd. (hereinafter referred to as "Shangjin Automation") was established in 2015 and is a National High-Tech Enterprise dedicated to the R&D and manufacturing of semiconductor packaging equipment, process technologies, and precision automation solutions.

Led by experts from the National Talent Program, the company has assembled a team of senior engineers with extensive expertise in mechanical engineering, electrical systems, motion control, process technology, software development, and machine vision.

The company’s core products include multi-functional wire bonders, fully automatic ball wedge wire bonders, fully automatic deep-cavity bonders, fully automatic thick-wire bonders, and high-precision dispensing and die attach machines. These products are widely applied in sectors such as integrated circuits, discrete devices, optical communication components, laser devices, microwave modules, sensors, MEMS, specialized instruments for smart devices, new energy power devices, and power semiconductors.